TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2

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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2

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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables ...

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Semiconductor Packaging glass substrate

JGS1 glass substrate

JGS2 glass substrate

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